Vacuum Plasma System
Customized Vacuum Plasma System
COWIN
Customized Vacuum Plasma System
| Process Mode | PE / RIE / Dual |
|---|---|
| Chamber | W.330 x D.350 x H.340 (mm) |
| LF Generator | 20~100kHz Max. 300W / 13.56MHz Max. 300W or 600W |
| MFC | Max. 500 sccm |
| Gauge Pressure | Atm ~ 5 x 10-4 Torr |
| Operation | Manual & Automatic |
| Geometry | W.800 x D.800 x H.1,800 (mm) |
Technical Data
Process Chamber
- Plasma Mode : PE (Plasma Etching) & RIE (Reactive Ion Etching) Mode
- Size : 330×350×340 (W×D×H, mm)
- Chamber structures : Single / Dual / Multi Electrodes / Extended chamber / Powder Treatment
- Uniform gas flow design (Patent No. 10-1697205)
Electrode
- Liquid cooling design
- Top ceramic insulation pocket
- RF noise shielding cover
Generator
- LF : 20~100kHz with Max. 300W
- RF : 13.56MHz with Max. 300W or 600W
- Automatic Impedance Matching
- Process Monitoring and Control
Gas flow module
- Maximum Number of gas channels : × 4 lines
- Gas flow control : High repeatability MFC
- Purge line : × 1 ea
- Vent line : × 1 ea
- MFC Flow rate : Max.500 sccm (1 sccm increment)
Vacuum Package
- Gauge: Pirani (5×10-4 Torr)
- Pump: Oil Rotary Pump
- Pump displacement: 842L/min @ 60Hz
- Ultimate Pressure: 5×10-3 Torr
System Dimension
- Main System : 800×800×1800 (W×D×H, mm)
- Vacuum Pump : 250×709×387 (W×D×H, mm)